The next big step in digital transformation

Artificial Intelligence in Manufacturing leading to Sustainability and Industry5.0

EFECS 2026 Helsinki · Finland 2–3 December 2026
AIMS5.0 · Results Explorer

Explore selected AIMS5.0 results

A curated selection from the project’s 179 registered exploitable results. Browse by industrial domain and see what is already implemented, under test, open source or moving through a commercial route.

179registered exploitable results
91results implemented
39key exploitable results
4.8 → 7.2average TRL, start to end

A further 63 results are under test. Together, these account for 154 of the 179 registered results, as reported at the October 2026 final review.

52 selected results
WP4 · Cross-domain enablersKEY RESULT

Digital Reference ontology

15 lobes, 1,500+ classes; 17 of 20 use cases connected; Apache 2.0

Infineon, FernUniversität in Hagen, NXP

Open source / public
WP3 · Cross-domain enablersKEY RESULT

Eclipse Arrowhead 5.2

Open source under EPL-2.0; used in UC02, 03, 05, 08 and 11 and taught at four universities

Luleå University of Technology and partners

Open source / public
WP4 · Cross-domain enablersKEY RESULT

Open Access Platform

Metadata marketplace with 17 ontologies; tools run where trust allows, raw data stays on site

Infineon, FernUniversität in Hagen and partners

In use / in production
UC10 · SemiconductorKEY RESULT

RAMII-based MES for semiconductor manufacturing

Production backbone for UC09, 12, 15 and 17; about 350 equipment set-ups coupled

Systema, Infineon

In use / in production
WP2 · Cross-domain enablersKEY RESULT

AI Toolbox

Public catalogue of 54 AI technologies with industrial validation

BME, EDI

Open source / public Read the story
WP3 · Cross-domain enablersKEY RESULT

AI-Gym

Open source in Eclipse Arrowhead; held an indoor farm at about 21 °C with live AI control

Research Studios Austria

Open source / public
WP7 · Cross-domain enablersKEY RESULT

EU AI Act compliance assistant

Checks the design documents of industrial AI use cases against the AI Act and GDPR

BME, Research Studios Austria

Validated / under test
WP7 · Cross-domain enablersKEY RESULT

QETAM user-acceptance method

Applied in the project-wide acceptance study; published open access

WP7 partners

Open source / public
UC15 · SemiconductorKEY RESULT

Fast SEM defect classification

37 defect classes, 92.7% validation accuracy, running on Infineon’s cloud platform

Infineon, KAI

In use / in production
UC15 · SemiconductorKEY RESULT

Efficient deep-learning training and deployment pipeline

Internal use for faster, more stable front-end production

KAI, Infineon

In use / in production
UC15 · SemiconductorKEY RESULT

Explainable anomaly detection (AcME-AD)

43% faster root-cause identification; about 45× faster explanations than KernelSHAP

University of Padova

Open source / public
UC15 · SemiconductorKEY RESULT

Industrial AI and MLOps platform

75% less time to build an ML model, 55% less time to monitor equipment

Statwolf

Commercial route
UC15 · SemiconductorKEY RESULT

Reusable AI lifecycle software (DBACS, B-ALIF, CeRULEo)

25% less data to scale a model to a new machine

University of Padova

Open source / public
UC15 · SemiconductorKEY RESULT

Interpretable anomaly detection and virtual inspection

Integrated into process monitoring and quality workflows

LFoundry

In use / in production
UC15 · SemiconductorKEY RESULT

Aluminium-corrosion classification tool

F1 score of 91.7% on industrial wafer images

LFoundry, University of Padova

Validated / under test
UC12 · Semiconductor

Short-term WIP forecasting and dashboard

OEE +33.8% in a selected work centre, against a 10% target

WU Vienna, HSZG, Infineon

Validated / under test Read the story
UC12 · Semiconductor

LogiFabSim rapid fab simulation

One simulated fab year in about two minutes

HSZG, TU Dresden, Infineon

Validated / under test Read the story
UC12 · Semiconductor

Digital Kanban for material delivery

Logistics digitisation between cleanroom and warehouse from 20% to 80%

Infineon, Systema

In use / in production Read the story
UC09 · Semiconductor

Energy-aware scheduling of batch furnaces

Up to 20% lower weighted tardiness; 11% lower electricity cost in the study

FernUniversität in Hagen, Infineon

Validated / under test Read the story
UC09 · Semiconductor

Cooling-network anomaly detection

98.6% accuracy in detecting and predicting anomalies

FernUniversität in Hagen, Infineon

Validated / under test Read the story
UC20 · Semiconductor

Test-wafer process harmonisation

76% of test-wafer process data harmonised between Villach and Dresden

Infineon Austria, Infineon

In use / in production
WP1 · Semiconductor

Enhanced RFID material tracking

99.68% read accuracy over more than 18 million reads

Infineon

In use / in production Read the story
UC13 · Semiconductor

Conveyor damage detection with piezo sensing

Models retrain as new data arrives on slow, noisy conveyors

Infineon Dresden, Hochschule Stralsund, TU Dresden

Validated / under test Read the story
WP1 · Semiconductor

Mobile cleanroom sensor platform

Fuses ToF camera, radar and LiDAR; 3.5 to 15 frames per second

University of Lübeck, Infineon Dresden

Validated / under test Read the story
UC17 · Semiconductor

Contamination sensor network

New sensors installed in a 300 mm fab with ML root-cause analysis

Fraunhofer IISB, Infineon, Pfeiffer Vacuum, Systema

Validated / under test
UC19 · Semiconductor

Master planning and knowledge-graph root-cause analysis

Baseline master plans in about 3 minutes; plan stability up to 40% higher

NXP and partners

Validated / under test
WP4 · Cross-domain enablers

Carbon Handprint tool

Maps scope 1 to 3 emissions along the value chain

Infineon and WP4 partners

Validated / under test
WP4 · Cross-domain enablers

Planning support tool

Outperforms conventional planning in the tested use cases

FernUniversität in Hagen and partners

Validated / under test
UC14 · Machinery & robotics

Virtual commissioning with digital twins

About 8 weeks earlier handover to the customer

Fabmatics

Validated / under test
UC14 · Machinery & robotics

HERO-SCOUT mobile robot and FlatStocker 3.0

Five test cases passed in an Infineon fab

Fabmatics

Validated / under test
UC5 · Machinery & robotics

Edge, fog and cloud data system for machine tools

Shop-floor data acquisition 20× faster; tool failures detected

IDEKO, Savvy Data Systems, Soraluce, Goimek

Validated / under test Read the story
WP1 · Machinery & robotics

Robot perception for shared shop floors

People detected within 5 m at more than 95% accuracy

Smart Universal

Validated / under test Read the story
WP1 · Machinery & robotics

Explainable traffic management and exoskeleton control

Predicts 4.8 s of worker movement; 81% intention accuracy

TÜBİTAK BİLGEM

Validated / under test Read the story
WP1 · Cross-domain enablers

MLOps framework for industrial models

Annotation, training, traceability, machine unlearning and edge deployment

DAC.digital

Validated / under test Read the story
UC2 · Consumer electronics

Production quality dashboard

Running on the OneBlade line; fall-off rate kept below 3%

Philips

In use / in production
UC2 · Consumer electronics

Process mining for production event logs

Peer-reviewed algorithm, integrated in the quality dashboard

Philips

Open source / public
UC2 · Consumer electronics

Human-like robotic device testing

Generative AI replays realistic consumer motion on a robot arm

Philips

Validated / under test
UC3 · Services & fleets

Zero Administration service platform

More than 80% less administrative effort in the live service

Husqvarna

In use / in production
UC3 · Services & fleets

Edge AI analytics engine

AI model lifecycle from about 40 days to just over 3; one code base on x86, ARM and RISC-V

Stream Analyze

Commercial route Read the story
UC3 · Services & fleets

Financial digital twin

Basis for usage-based financing and asset valuation

SEB

Validated / under test
UC4 · Automotive & logistics

Drone scanning and point-cloud digital twin

One dataset for planning, simulation, tracking and as-built documentation

BMW Group, IPH

Validated / under test
UC4 · Automotive & logistics

Physical AI training and simulation platform

Reusable, hardware-agnostic platform for robot training

BMW Group

Validated / under test
UC4 · Automotive & logistics

Depth-sensing benchmark and 3D reconstruction

Six depth cameras benchmarked; multi-view reconstruction of a car

Universidad Politécnica de Madrid

Open source / public
UC1 · Automotive & logistics

Green AI lifecycle for logistics

Scenario: 15.4% less COâ‚‚ (well-to-wheel) and 17.4% lower energy cost

AIDI and partners

Validated / under test
UC7 · Consumer electronics

Metal 3D printer for luminaire parts

First-of-a-kind directed energy deposition with real-time camera monitoring

Signify

Validated / under test Read the story
UC11 · Food & farming

Indoor farm monitoring and edge control

Plant detection accuracy and recall above 90%

Zelos Plant, TTTech, RSA, AIT

Validated / under test
UC11 · Food & farming

ThreatGet cyber security analysis

Model-based threat analysis aligned with the Cyber Resilience Act

AIT Austrian Institute of Technology

Commercial route
UC16 · Aviation & RF

ML-accelerated RF MEMS design and fabrication

Re-design time down more than 50%; gold use cut by more than 45%

Thales, FORTH

Validated / under test
WP1 · Aviation & RF

On-chip SAW temperature and RF MEMS leakage sensors

Protect components not designed for high-power signals

FORTH, Thales

Validated / under test Read the story
WP1 · Cross-domain enablers

5G standalone campus network validation

Measures quality of service across sessions, handover and slicing

AITIA

Open source / public Read the story
WP1 · Cross-domain enablers

Wireless connectivity testbed

Smart antenna and 36 beacons, orchestrated remotely

Gdańsk University of Technology

Validated / under test Read the story
WP3 · Cross-domain enablers

SysMLv2 library for service-oriented architectures

Presented at the OMG technology meeting, April 2026

CEA, LTU, PTC

Open source / public Read the story
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The AIMS5.0 project is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Funding Authorities from involved countries under grant agreement no. 101112089.